PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD

摘要

Provided is a photosensitive resin composition which has excellent heat resistance, pore explosion resistance, empty foam resistance and crack resistance. A photosensitive resin composition of the present invention contains (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a diluent solvent, (D) a compound that has two or more ethylenically unsaturated groups in each molecule and (E) a thermosetting component that has two or more cyclic ether groups and/or cyclic thioether groups in each molecule. This photosensitive resin composition is characterized in that: (A-1) a carboxyl group-containing resin which is obtained by reacting an esterified product of an epoxy group, said esterified product being produced by reacting (a) at least one kind of a bisphenol type epoxy compound and (b) an unsaturated carboxylic acid, with (c) a saturated or unsaturated polybasic acid anhydride is contained as the carboxyl group-containing resin (A); and the thermosetting component (E) has an average epoxy equivalent weight of 200 or more.

主权项

1: A photosensitive resin composition, comprising:
a carboxyl group-containing resin (A); a photopolymerization initiator (B); a dilute solvent (C); a compound (D) that has in its molecule two or more ethylenic unsaturated groups; and a thermosetting component (E) that has in its molecule two or more cyclic ether groups and/or cyclic thioether groups, wherein the carboxyl group-containing resin (A) includes (A-1) a carboxyl group-containing resin that is obtained by reacting (a) at least one species of bisphenol type epoxy compound, (b) an esterification product of an epoxy group that is produced by an esterification reaction with an unsaturated carboxyl group, and (c) a saturated or unsaturated polybasic acid anhydride, and the thermosetting component (E) has an average epoxy equivalent weight of 200 or more.