PROBE DEVICE

摘要

PROBLEM TO BE SOLVED: To realize reducing of contact resistance and uniformization between a rear side electrode and a placement surface conductor of a chuck top, relating to a probe device which performs electrical characteristic inspection of a power device containing an electrode on both surfaces of the substrate at a wafer level.SOLUTION: In a probe device, a sucking mechanism for holding a semiconductor wafer W on a chuck top 12 has innumerable vertical fine holes in a pattern that satisfies a condition of &phgr;