发明名称 Flat Plate Cooling Device and Method for Using the Same
摘要 In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.
申请公布号 US2015034288(A1) 申请公布日期 2015.02.05
申请号 US201214349034 申请日期 2012.09.26
申请人 Matsunaga Arihiro;Sakamoto Hitoshi;Yoshikawa Minoru;Chiba Masaki;Inaba Kenichi 发明人 Matsunaga Arihiro;Sakamoto Hitoshi;Yoshikawa Minoru;Chiba Masaki;Inaba Kenichi
分类号 F28F3/12 主分类号 F28F3/12
代理机构 代理人
主权项 1. A flat plate cooling device, comprising: a plate-like container comprising a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container comprises a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit comprises a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.
地址 Tokyo JP