发明名称 |
Flat Plate Cooling Device and Method for Using the Same |
摘要 |
In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area. |
申请公布号 |
US2015034288(A1) |
申请公布日期 |
2015.02.05 |
申请号 |
US201214349034 |
申请日期 |
2012.09.26 |
申请人 |
Matsunaga Arihiro;Sakamoto Hitoshi;Yoshikawa Minoru;Chiba Masaki;Inaba Kenichi |
发明人 |
Matsunaga Arihiro;Sakamoto Hitoshi;Yoshikawa Minoru;Chiba Masaki;Inaba Kenichi |
分类号 |
F28F3/12 |
主分类号 |
F28F3/12 |
代理机构 |
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代理人 |
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主权项 |
1. A flat plate cooling device, comprising:
a plate-like container comprising a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container comprises a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit comprises a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area. |
地址 |
Tokyo JP |