PHOTOSENSITIVE-RESIN COMPOSITION

摘要

This invention pertains to a photosensitive-resin composition containing the following: (A) an acid-modified-vinyl-group-containing epoxy resin; (B) an acyl-phosphine-oxide photopolymerization initiator; (C) one or more additives selected from among (C1) alkylamino-benzene derivatives, (C2) pyrazoline sensitizers or anthracene sensitizers, (C3) one or more photopolymerization initiators selected from among imidazole photopolymerization initiators, acridine photopolymerization initiators, and titanocene photopolymerization initiators, (C4) one or more antioxidants selected from among hindered-phenol antioxidants, quinone antioxidants, amine antioxidants, sulfur antioxidants, and phosphorus antioxidants, and (C5) thiol-group-containing compounds; and (D) a photopolymerizable compound.