发明名称 |
Lead-Free Solder Alloy |
摘要 |
A lead-free solder alloy consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn has a low melting point for suppressing warping of a thin substrate during soldering. It can form solder joints with high reliability even when used for soldering to electrodes having a Ni coating which contains P, since the growth of a P-rich layer is suppressed so that the shear strength of the joints is improved and the alloy has a high ductility and a high tensile strength. |
申请公布号 |
US2015037087(A1) |
申请公布日期 |
2015.02.05 |
申请号 |
US201313959224 |
申请日期 |
2013.08.05 |
申请人 |
Senju Metal Industry Co., Ltd. |
发明人 |
Tachibana Ken;Nomura Hikaru;Lee Kyu-oh |
分类号 |
B23K35/26 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
1. A lead-free solder alloy having an alloy composition consisting essentially of, in mass percent, Bi: 31-59%, Sb: 0.15-0.75%, at least one element selected from Cu: 0.3-1.0% and P: 0.002-0.055%, and a balance of Sn. |
地址 |
Tokyo JP |