BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CONDUCTORS
摘要
A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer.
申请公布号
WO2015017143(A1)
申请公布日期
2015.02.05
申请号
WO2014US47212
申请日期
2014.07.18
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
STAY, MATTHEW S.;PEKUROVSKY, MIKHAIL L.;DODDS, SHAWN C.;GILMAN, ANN M.;THEIS, DANIEL J.