发明名称 EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART
摘要 <p>There is provided a multilayer ceramic electronic component, including a ceramic body having first and second side surfaces facing each other, and first and second end surfaces facing each other; first and second internal electrodes having first and second lead portions; and first and second external electrodes extended from the first and second end surfaces of the ceramic body to the first and second side surfaces, respectively, wherein when a distance from an end portion of the first or second external electrode formed on the first or second side surface of the ceramic body to a point of the first or second external electrode connected to the first or second lead portion is defined as G, and a width of the first or second external electrode on the first or second side surface of the ceramic body is defined as BW, 30μm≰G<BW is satisfied.</p>
申请公布号 KR101489816(B1) 申请公布日期 2015.02.04
申请号 KR20130086323 申请日期 2013.07.22
申请人 发明人
分类号 H01G2/06;H01G4/12;H01G4/30 主分类号 H01G2/06
代理机构 代理人
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