| 摘要 |
A stack package is formed by vertically stacking: a first chip including a first chip body, a first through electrode which penetrates the first chip body, and an insulating layer arranged on the upper side of the first chip body; a second chip including a second chip body, a second through electrode which penetrates the second chip body, and a bump arranged in the lower surface of the second chip. The bump penetrates the insulating layer, is inserted into the first through electrode. The lower side of the second chip body is in direct contact with the surface of the insulating layer. |
