发明名称 パワーモジュール用基板およびヒートシンク付パワーモジュール用基板の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink having high junction reliability in which peeling does not occur at the junction of a ceramic substrate and a metal plate even if a flux brazing method is applied. <P>SOLUTION: The method of manufacturing a power module with a heat sink includes a first brazing step for brazing a metal plate 13 having a high oxygen concentration part 17 on the side surface 13a and a ceramics substrate 11 in a laminated state, and a second brazing step for joining the metal plate 13 and a heat sink 14 by a brazing method using flux 16. At the second brazing step, the flux 16 protruding from between the metal plate 13 and the heat sink 14 is caused to react on the high oxygen concentration part 17. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5664024(B2) 申请公布日期 2015.02.04
申请号 JP20100192145 申请日期 2010.08.30
申请人 发明人
分类号 H01L23/12;H01L23/14;H01L23/36;H01L25/07;H01L25/18 主分类号 H01L23/12
代理机构 代理人
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