| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can efficiently radiate heat generated by an electronic component via a metal plate and a mold resin, and ensure electrical insulation properties, and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: an electronic component 20 having electrode on both surfaces; a substrate 30 on which the electronic component 20 is arranged and electrically connected to one of the electrodes; a metal plate 40 arranged on the electronic component 20 and electrically connected to the other of the electrodes; a mold resin 50 integrally encapsulating the electronic component 20, at least a part of the substrate 30 and the metal plate 40; and a resin sheet 60 arranged at least one of between two components so as to face each other such as between the electronic component 20 and the substrate 30, and between the electronic component 20 and the metal plate 40. The resin sheet 60 includes connection vias 61 each composed of a conductive material and arranged in a via hole. The two components sandwiching the resin sheet 60 contact the connection vias 61 and are bonded via the connection vias 61. |
