发明名称 熱電変換モジュール
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module which has a high performance index by increasing thermal resistance without significantly changing a structure and an assembly method. <P>SOLUTION: A thermoelectric conversion module 10 for converting heat into electricity comprises: a pair of substrates 13 and 14 having wiring 11 and 12 formed thereon; and a plurality of semiconductor elements 15 series-mounted via the wiring 11 and 12 between the substrates 13 and 14. Each of the semiconductor elements 15 is formed by laminating thermoelectric conversion elements 31 and a conductive resin layer 32 having lower thermal conductivity than the thermoelectric conversion elements 31. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5664158(B2) 申请公布日期 2015.02.04
申请号 JP20100255608 申请日期 2010.11.16
申请人 发明人
分类号 H01L35/32;H02N11/00 主分类号 H01L35/32
代理机构 代理人
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