| 摘要 |
<p>On a back face of a semiconductor wafer, an annular convex portion is formed at an outer periphery so as to surround a flat concave portion formed by back grinding. The back face of the semiconductor wafer is pressed against an adhesive surface of a supporting adhesive tape joined to a ring frame. Thus, the annular convex portion is joined to the adhesive tape. Further, the adhesive tape is deformed while being pressed from a side of its non-adhesive surface. As a result, the adhesive tape is pushed into and joined to the flat concave portion of the back face of the semiconductor wafer.</p> |
