| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board having excellent long-term reliability in which heat generated from an electronic component is dissipated well by preventing an insulating substrate from cracking or breaking, and to provide an electronic device. <P>SOLUTION: The circuit board 10 comprises an insulating substrate 1 having a through hole, metal plates 3 attached to both surfaces of the insulating substrate 1 to close the through hole and on which an electronic component 20 is mounted, a metal body 5 arranged in the through hole and having both ends bonded, respectively, to the metal plates 3 attached to both surfaces of the insulating substrate 1, and a frame 6 having an outer surface bonded to the inner wall surface of the through hole with a soldering material layer 2 interposed therebetween and having a thermal expansion coefficient smaller than that of the metal body 5. The insulating substrate 1 is prevented from cracking or breaking by dissipating heat generated from the electronic component 20 efficiently to the outside. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
