Light emitting device, light emitting module, and method for manufacturing light emitting device

摘要

According to one embodiment, a light emitting device includes a semiconductor layer, a p-side electrode, an n-side electrode, a first insulating layer, a p-side interconnect layer, an n-side interconnect layer, and a second insulating layer. The portion of the second p-side interconnect layer has the L-shaped cross section being configured to include a p-side external terminal exposed from the first insulating layer and the second insulating layer at a third surface having a plane orientation different from the first surface and the second surface. The portion of the second n-side interconnect layer has the L-shaped cross section being configured to include an n-side external terminal exposed from the first insulating layer and the second insulating layer at the third surface.

主权项

1. A light emitting device, comprising:
a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer provided between the first surface and the second surface; a p-side electrode provided on the semiconductor layer; an n-side electrode provided on the semiconductor layer; a first insulating layer provided on the second surface side, the first insulating layer having a first via communicating with the p-side electrode and a second via communicating with the n-side electrode; a p-side interconnect layer including a first p-side interconnect layer electrically connected to the p-side electrode through the first via, and a second p-side interconnect layer electrically connected to the first p-side interconnect layer and provided on an interconnect surface provided on a side of the first insulating layer opposite to the semiconductor layer, the second p-side interconnect layer including a portion having a U-shaped cross section; an n-side interconnect layer including a first n-side interconnect layer electrically connected to the n-side electrode through the second via, and a second n-side interconnect layer electrically connected to the first n-side interconnect layer, separated from the p-side interconnect layer and provided on the interconnect surface, the second n-side interconnect layer including a portion having a U-shaped cross section; and a second insulating layer provided between the p-side interconnect layer and the n-side interconnect layer, the portion of the second p-side interconnect layer having a p-side external terminal exposed from the first insulating layer and the second insulating layer at a third surface having a plane orientation different from the first surface and the second surface, the portion of the second n-side interconnect layer having an n-side external terminal exposed from the first insulating layer and the second insulating layer at the third surface.