| 摘要 |
<p>A COF package includes: a base film, an IC chip, a first line, a second line, a via pattern, and a common line. The base film includes a bending region where bending is generated. The first line is formed on the upper side of the base film, and is overlapped with the bending region. The second line is formed on the lower side of the base film, and is overlapped with the bending region. The via pattern penetrates the base film and electrically connects the first line and the second line. Part of the first line and part of the second line may not be overlapped with each other on a plane.</p> |
