发明名称 Semiconductor device having elevated structure and method of manufacturing the same
摘要 A semiconductor device includes a semiconductor substrate; a gate stack overlying the substrate, a spacer formed on sidewalls of the gate stack, and a protection layer overlying the gate stack for filling at least a portion of a space surrounded by the spacer and the top surface of the gate stack. A top surface of the spacer is higher than a top surface of the gate stack.
申请公布号 US8946828(B2) 申请公布日期 2015.02.03
申请号 US201012702683 申请日期 2010.02.09
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Sun Sey-Ping;Lee Tsung-Lin;Lin Chin-Hsiang;Chang Chih-Hao;Yeh Chen-Nan;Jong Chao-An
分类号 H01L29/78;H01L21/768;H01L29/66 主分类号 H01L29/78
代理机构 Lowe Hauptman & Ham, LLP 代理人 Lowe Hauptman & Ham, LLP
主权项 1. A semiconductor device, comprising: a semiconductor substrate having at least an active area on a top surface thereof; a gate stack formed over the active area, said active area further comprising source and drain regions adjacent the gate stack; a spacer formed on sidewalls of the gate stack; an elevated contact structure extending upwardly from the source or drain region to have a top surface higher than a top surface of the gate stack; a protection layer overlying the top surface of the gate stack, the top surface of the elevated contact structure, and the spacer, the protection layer filling at least a portion of a space formed between the top surface of the elevated contact structure and the top surface of the gate stack; a dielectric layer overlying the protection layer, the dielectric layer comprising a material different from a material of the protection layer; and a contact hole extending from a top surface of the dielectric layer, through the dielectric layer, through a partial thickness of the protection layer, and to the top surface of the elevated contact structure without reaching the spacer.
地址 TW