| 摘要 |
<p>Disclosed are a film forming device and film forming method which are low cost, adaptable to larger sized substrates, and have a short tact time. A substrate holding frame (12), onto which a substrate (11) is mounted, is loaded into an evacuated vacuum chamber (41). The substrate (11) on the substrate holding frame (12) is brought to rest at a position facing a mask (15) on a mask holding frame (43) which is disposed between a substrate conveyance path and outlets (42c) of a vapor deposition source (42). The substrate holding frame (12) is then detached from conveyance members on a conveyance mechanism (51) and the underside of the substrate (11) is held to the surface of a substrate attraction plate (81b) by electrostatic attraction. Subsequently, the mask (15) is aligned to the substrate (11), and with both the substrate (11) and the mask (15) brought to rest facing the vacuum chamber (41), the vapor of a film-forming material is emitted from the outlets (42c), forming a film on the surface of the substrate (11) from the vapor. After the film is formed, the substrate holding frame (12) on which the substrate (11) is mounted is unloaded to the outside of the vacuum chamber (41) while the mask remains mounted on the mask holding frame (43) in the vacuum chamber (41).</p> |
