| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a joint body of a sputtering target and a backing plate, capable of effectively reducing the generation of particles during sputtering from the initial stage to the last stage of a target lifetime and simply obtained, and a film deposition method using the same.SOLUTION: In a sputtering target joint body having a sputtering target 1 joined with a backing plate 2 for holding the sputtering target, both the sputtering target 1 and the backing plate 2 are sintered bodies and are constituted of a dielectric body having a relative dielectric constant of 2-1500.</p> |
