| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor device which meets requirements in layout on a mounting substrate side.SOLUTION: A BGA 5 comprises: a wiring board 1 including a plurality of bonding leads 1c provided on a top face 1a which is formed in a rectangular form; a semiconductor chip 2 which includes a plurality of electrode pads 2c formed on a principal surface 2a formed in a nearly-square rectangular form and which is mounted on the top face 1a of the wiring board 1; and a plurality of metal wires 4 for connecting the plurality of bonding leads 1c of the wiring board 1 and the plurality of electrode pads 2c of the semiconductor chip 2. In the BGA 5, the plurality of metal wires 4 are arranged on three sides of the principal surface 2a of the semiconductor chip 2, the plurality of bonding leads 1c are provided on each outside of opposite short sides of the principal surface 2a of the semiconductor chip 2 and in a plurality of rows, and the plurality of metal wires 4 are connected to the plurality of bonding leads 1c. |
