| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique capable of efficiently jointing a thin film component to a jointing object without breakage using ultrasonic vibration.SOLUTION: When a thin film capacitor 41 is jointed to a substrate 5 using ultrasonic vibration, one thin film capacitor 41 is cut away from a sheet-like component assembly 4 by ultrasonic vibration. Thereby, plural thin capacitors 41 can be easily handled while keeping the sheet-like component assembly 4, which is efficient. Also, the thin film capacitors 41 are connected to the substrate 5 using ultrasonic vibration, and therefore, there is no risk that a capacitor 42 (metal pads 42a1, 42c1) provided on the thin film capacitors is short-circuited by solder re-molten in a heating cycle such as reflow. Accordingly, the thin film capacitors 41 can be efficiently jointed to the substrate 5 without breakage using ultrasonic vibration.</p> |
