| 摘要 |
<p>The present disclosure provides a flip chip type light emitting diode which comprises a substrate (20) and a light emitting diode chip (10). The substrate comprises a body (43), a plurality of third pads (23), a fourth pad (24), a first electrode (25), a second electrode (26), a plurality of first vias (21), and a second via (22). The body (43) has a first surface (20a) and a second surface (20b) opposite to the first surface. The third pads (23) and the fourth pad (24) are disposed on the first surface (20a) of the body (43). The first electrode (25)and the second electrode (26) are disposed on the second surface (20b) of the body (43). The first vias (21) traverse through the body (43) and are each electrically coupled to a respective one of the third pads (23) and the first electrode (25). The second via (22) traverses through the body (43) and is electrically coupled to the fourth pad (24) and the second electrode (26).</p> |
