| 摘要 |
<p>The present invention provides a light emitting device package including a package body; first and second lead frames of which a part is exposed and is arranged on the package body; a light emitting device which is electrically connected to the first and the second lead frame; and a zenor diode which is electrically connected to the first and the second lead frame and of which at least five surfaces are in contact with the package body. The light emitting device can secure a wide cavity space without degradation of the optical efficiency of the light emitting device package.</p> |
