| 摘要 |
<p>The present invention relates to a head for mounting a semiconductor chip, and more specifically, to a head for mounting a semiconductor chip which is formed of a structure capable of rotary and straight motions while using laser in order to accurately mount a semiconductor chip on a substrate. The present invention includes a case (1000) having an accommodation unit inside; a first position control unit (2000) fixed to the case (1000), and vertically being moved; a second position control unit (3000) coming in contact with the first position control unit (2000), and pressing a semiconductor chip (C) toward an upper portion of a substrate (P); and a bonding unit (4000) mounted on a lower portion of the second position control unit (3000), and bonding the semiconductor chip (C) to the upper portion of the substrate (P) using laser by gripping the semiconductor chip (C) in a vacuum state. The present invention precisely controls vertical and rotary motions of the head to minimize error when bonding the semiconductor chip to the substrate using laser.</p> |
