| 摘要 |
The purpose of the present invention is providing an epoxy resin composition which can thoroughly seal a semiconductor apparatus having a small gap between a semiconductor device and a wiring board, and has excellent fluidity. The present invention relates to an epoxy resin composition which includes an inorganic filler, an epoxy resin and a curing agent, wherein the inorganic filler (i) has the average particle diameter (D50) of 2-10 μm, (ii) has the average particle diameter (D10) of 0-3 μm, (iii) has the average particle diameter (D90) of 6-15 μm, and (iv) includes 0.1 wt% or less of an inorganic filler having the particle diameter of 25 μm or less of the total inorganic filler, and to a semiconductor apparatus prepared by using the same. |
