发明名称 硬化性組成物、硬化物および光半導体装置
摘要 A curable composition is characterized in including a compound (A) represented by the following formula (1), a polysiloxane (B) represented by the following chemical formula (2) and a catalyst for hydrosilylation reaction. (R33SiO1/2)a(R42SiO2/2)b(R52SiO2/2)c(R6SiO3/2)d(SiO4/2)e(XO1/2)f (2) The curable composition of this invention can form a cured product having high durability to thermal shock, etc. and hardly generating cracks even in a harsh circumstance.
申请公布号 JP5660145(B2) 申请公布日期 2015.01.28
申请号 JP20130007112 申请日期 2013.01.18
申请人 发明人
分类号 C08L83/07;C08L83/05;H01L23/29;H01L23/31;H01L33/56 主分类号 C08L83/07
代理机构 代理人
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