发明名称 デスミア処理方法
摘要 <p>PROBLEM TO BE SOLVED: To provide a desmearing method capable of removing smear caused by an inorganic material and an organic material reliably, without using a chemical requiring waste liquid treatment.SOLUTION: A desmearing method of a wiring board material produced by laminating an insulating layer composed of a resin containing a granular filler and a conductive layer includes an ultraviolet light irradiation step for irradiating the wiring board material with ultraviolet light having a wavelength less than 220 nm under a gas atmosphere containing oxygen, and a physical vibration step for giving physical vibration to the wiring board material passed through the ultraviolet light irradiation step.</p>
申请公布号 JP5660117(B2) 申请公布日期 2015.01.28
申请号 JP20120283808 申请日期 2012.12.27
申请人 发明人
分类号 H05K3/42;H05K3/00 主分类号 H05K3/42
代理机构 代理人
主权项
地址