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发明名称
ELECTRONIC DEVICES ASSEMBLED WITH THERMALLY INSULATING LAYERS
摘要
<p>Provided herein are electronic devices assembled with thermally insulating layers.</p>
申请公布号
KR101487147(B1)
申请公布日期
2015.01.28
申请号
KR20147014621
申请日期
2012.11.09
申请人
发明人
分类号
G06F1/20;H05K7/20
主分类号
G06F1/20
代理机构
代理人
主权项
地址
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