发明名称 電子部品装着装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting device in which an operation state of a beam is improved to increase production efficiency of a printed circuit board. <P>SOLUTION: An electronic component attachment device comprises: a conveyance device; a component supply device; beams 4A and 4B; and mounting heads 7. When an electronic component is mounted on a printed circuit board P, drive sources for the beams 4A and 4B movable in one direction are driven and drive sources for the mounting heads 7 having suction nozzles 9, provided between the beams 4A and 4B, and movable in a direction along the beam 4A and 4B, respectively, are driven, to move the mounting heads 7 between the printed circuit board P and the component supply device on the conveyance device. When suction nozzles 9 provided in the mounting heads 7 mount electronic components on the printed circuit board P at the same time in a region in which the mounting heads 7 approach each other in the direction along the beams 4A and 4B to collide with each other, the device prevents mounting heads 7 from colliding with each other in the direction along the beams 4A and 4B. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5658707(B2) 申请公布日期 2015.01.28
申请号 JP20120083232 申请日期 2012.03.30
申请人 株式会社日立ハイテクインスツルメンツ 发明人 柏谷 尚克;山口 正樹
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
主权项
地址