| 摘要 |
A method to manufacture a printed circuit board precursor includes a step of providing a substrate. Then a catalyst layer is formed by processing the surface of the substrate with a catalyst. Subsequently, a conductive layer is attached by being formed on the surface of the catalyst layer. Lastly, a metal layer is electrically plated on the conductive layer. The printed circuit board precursor includes a substrate having a surface. Especially, the surface has the catalyst layer formed by processing the surface with the catalyst. The precursor is attached to the catalyst layer, includes the conductive layer covering the catalyst layer, and also includes the metal layer arranged on the conductive layer. |
