| 摘要 |
<p>The prevent invention relates to a wafer processing apparatus. Particularly, the prevent invention relates to a wafer processing apparatus to partly dip a substrate, rotate and clean the substrate. A wafer processing apparatus according to an embodiment of the present invention may include a casing which has a receiving space for receiving a cleansing solution, a substrate rotation member which is installed at the casing and rotates at least one substrate in a direction intersecting with the ground surface, and a height control member which controls the height of the substrate rotation member. According to the present invention, substrates can be simultaneously cleaned with high detergency. Particularly, a part of the substrate is dipped to be rotated, thereby rotating the substrate with high speed and improving detergency. Also, a fixing unit of fixing the substrate has a round shape, thereby reducing flow resistance against the cleaning solution and improving cleaning efficiency.</p> |
