METHODS FOR FABRICATING AND ORIENTING SEMICONDUCTOR WAFERS

摘要

A method of orienting a semiconductor wafer is provided. The method includes: rotating a wafer about a central axis; exposing a plurality of edge portions of the rotating wafer to light having a predetermined wavelength from one or more light sources; detecting a subsurface mark in one of the plurality of edge portions of the rotating wafer; and orienting the wafer using the detected subsurface mark as a reference.