| 摘要 |
PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition containing a polyamic acid, which gives a polyimide resin that can be favorably patterned by a photolithography method and has excellent heat resistance, and to provide a method for producing a patterned polyimide resin film using the composition, a flexible film having the polyimide resin film obtained by the production method, and a flexible substrate including the film.SOLUTION: The negative photosensitive resin composition comprises: (A) a polyamic acid having a mass average molecular weight of 4000 to 60000 and a dispersion degree of 3.5 or less; (B) a compound that generates an acid or a base by an action of light; and (C) N,N,N',N'-tetramethylurea. The method for producing a patterned polyimide resin film includes: a coating film forming step of forming a coating film of the composition; an exposure step of selectively exposing the coating film; a developing step of developing the coating film after exposed; and a heating step of heating the coating film after developed. |
