发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves more data rewritable times and a higher data rewrite speed, and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device comprises: a semiconductor substrate SUB; a first gate electrode CG; a second gate electrode MG; an insulation film ONI; and a pair of source/drain regions MS, MD. The first gate electrode CG is composed of a semiconductor layer containing a first conductivity type impurity, and the second gate electrode MG is composed of a semiconductor layer containing a second conductivity type impurity, and the source/drain regions MS, MD contain a first conductivity type impurity. The source region MS includes a first source region MS1 and a second source region MS2 which has a concentration of the first conductivity type impurity higher than that of the first source region MS1.
申请公布号 JP2015015384(A) 申请公布日期 2015.01.22
申请号 JP20130141637 申请日期 2013.07.05
申请人 RENESAS ELECTRONICS CORP 发明人 MORIMOTO YASUSHI
分类号 H01L21/336;H01L21/8247;H01L27/10;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/336
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