SUBSTRATE, CHIP PACKAGE AND METHOD FOR MANUFACTURING SUBSTRATE

摘要

A substrate includes a first wiring substrate, a second wiring substrate, and an adhesive sheet. The first wiring substrate includes a number of first connecting pads and a first penetrating room. The second wiring substrate includes a number of second connecting pads. The adhesive sheet includes a number of through holes and a second penetrating room. The through holes are filled with a conducting material. The adhesive sheet and the first wiring substrate are orderly pressed on the second wiring substrate. The conducting material is connected to the first connecting pads and the second connecting pads. The first penetrating room of the first wiring substrate and the second penetrating room of the adhesive sheet cooperatively form a receiving recess.

主权项

1. A method for manufacturing a substrate, comprising:
providing a first wiring substrate, the first wiring substrate comprising a plurality of first connecting pads and defining a first penetrating room penetrating two opposite sides of the first wiring substrate; providing a second wiring substrate the second wiring substrate comprising a plurality of second connecting pads; and proving an adhesive sheet, the adhesive sheet defining a plurality of through holes and a second penetrating room, the through holes filled with a conducting material, the second penetrating room penetrating two opposite sides of the adhesive sheet; and orderly pressing the adhesive sheet and the first wiring substrate on the second wiring substrate, with the conducting material connected to the first connecting pads and the second connecting pads and the first penetrating room of the first wiring substrate and the second penetrating room of the adhesive sheet cooperatively forming a receiving recess.