| 发明名称 |
WIRING SUBSTRATE, METHOD OF MANUFACTURING WIRING SUBSTRATE, COMPONENT-EMBEDDED GLASS SUBSTRATE, AND METHOD OF MANUFACTURING COMPONENT-EMBEDDED GLASS SUBSTRATE |
| 摘要 |
A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof. |
| 申请公布号 |
US2015021081(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201414327389 |
申请日期 |
2014.07.09 |
| 申请人 |
Sony Corporation |
发明人 |
Mitarai Shun;Yanagawa Shusaku;Rokuhara Shinji;Oka Shuichi |
| 分类号 |
H05K3/10;H05K1/18;H05K3/30;H05K1/11 |
主分类号 |
H05K3/10 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate, the method comprising:
forming an alteration layer that penetrates the wiring substrate and is patterned; forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed; and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof. |
| 地址 |
Tokyo JP |
