METALIZED PLASTIC HEADER APPARATUS AND METHODS OF MANUFACTURE AND USE

摘要

A low cost and highly consistent metallized header electronic assembly. In one embodiment, a metallized header assembly having electronic circuitry as well as terminals manufactured from an LDS polymer is disclosed. The metallized header assembly also includes electronic component receiving cavities configured to house one or more wire-wound magnetic cores. The wire leads from the wire-wound magnetic cores are electrically coupled to the terminals on the metallized header assembly via a eutectic solder using well known soldering techniques such as hand soldering, solder dipping, resistance welding, and the like. Methods of manufacturing and using the aforementioned metallized header assembly are also disclosed.

主权项

1. A metallized header electronic apparatus for mounting onto the surface of a printed circuit board, comprising:
a header assembly having electronic circuitry disposed thereon; one or more inductive devices housed within the header assembly, the one or more inductive devices each having one or more wire leads extending therefrom; and one or more terminals associated with the header assembly, the one or more terminals having the one or more wire leads attached thereto.