| 摘要 |
PROBLEM TO BE SOLVED: To shorten the time before starting of measurement, with a simple device configuration.SOLUTION: An electric connection device includes a wiring board 14 which is arranged above a chuck top 21, with a wiring path 14a connected to a tester 11 being formed, a probe card 19 containing a probe substrate 18 which is arranged in such a manner as one surface faces the wiring board 14, being away from the wiring board 14, with a wiring path 18e formed to correspond to the wiring path 14, and a plurality of probes 18a which are provided on the other surface of the probe substrate 18, being connected to the wiring path 18e, being capable of contacting to each of a plurality of connection pad 28a of a semiconductor wafer 28 on the chuck top 21, and an electric connection part 16 which makes connection using low heat conduction support members 16f, 16g for reducing heat conduction between the wiring board 14 and the probe substrate 18, and electrically connects the wiring path 14a and the wiring path 18e. |
