发明名称 INLINE DEPOSITION CONTROL APPARATUS AND METHOD OF INLINE DEPOSITION CONTROL
摘要 An inline deposition control apparatus for a vacuum deposition apparatus having one or more deposition sources for depositing one or more deposition layers on a substrate, includes one or more light sources adapted to illuminate the substrate having the one or more deposition layers; a detection arrangement adapted for spectrally resolved detection of a measurement signal, wherein the measurement signal is selected from at least one of: light reflected at the substrate having the one or more deposition layers, and light transmitted through the substrate having the one or more deposition layers; an evaluation unit to determine the respective thicknesses of the one or more layers based on the measurement signal; and a controller connected to the evaluation unit and connectable to the deposition apparatus for feed-back control of the deposition of the one or more deposition layers based on the determined thicknesses. Furthermore, a method of inline deposition control is provided.
申请公布号 US2015021168(A1) 申请公布日期 2015.01.22
申请号 US201314025450 申请日期 2013.09.12
申请人 Applied Materials, Inc. 发明人 LOTZ Hans-Georg
分类号 C23C14/54;H01J37/34 主分类号 C23C14/54
代理机构 代理人
主权项 1. An inline deposition control apparatus for a vacuum deposition apparatus having one or more deposition sources for depositing one or more deposition layers on a substrate, comprising: one or more light sources adapted to illuminate the substrate having the one or more deposition layers; a detection arrangement adapted for spectrally resolved detection of a measurement signal, wherein the measurement signal is selected from at least one of: light reflected at the substrate having the one or more deposition layers, and light transmitted through the substrate having the one or more deposition layers; an evaluation unit to determine the respective thicknesses of the one or more layers based on the measurement signal; and a controller connected to the evaluation unit and connectable to the deposition apparatus for feed-back control of the deposition of the one or more deposition layers based on the determined thicknesses.
地址 Santa Clara CA US