发明名称 |
Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same |
摘要 |
<p>A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.</p> |
申请公布号 |
EP2141201(B1) |
申请公布日期 |
2015.01.21 |
申请号 |
EP20090008627 |
申请日期 |
2009.07.01 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YUSUKE, TAGUCHI;TOSHIO, SHIOBARA |
分类号 |
C08L63/06;C08K3/00;C08L63/00;C08L83/04;H01L23/29 |
主分类号 |
C08L63/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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