发明名称 |
TREATMENT, BEFORE THE BONDING OF A MIXED COPPER OXIDE SURFACE, BY A PLASMA CONTAINING NITROGEN AND HYDROGEN |
摘要 |
<p>A method for bonding a first surface provided with at least one copper area surrounded by a silicon oxide area to a second surface includes an operation of treatment of the first surface by a plasma, before placing the first surface in contact with the second surface. The plasma is formed from a gas source containing a silicon oxide nitriding agent and a copper oxide reducing agent containing hydrogen. The gas source may include an N2 and NH3 and/or H2 gas mixture or a N2O and H2 gas mixture, or ammonia, which is then used both as a nitriding agent and as a reducing agent. The plasma obtained from this gas source then necessarily contains nitrogen and hydrogen, which enables, in a single operation, to provide a high-performance bonding between the first and second surfaces.</p> |
申请公布号 |
EP2612347(B1) |
申请公布日期 |
2015.01.21 |
申请号 |
EP20110758495 |
申请日期 |
2011.08.31 |
申请人 |
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIESALTERNATIVES |
发明人 |
VANDROUX, LAURENT;DI CIOCCIO, LÉA;GUEGUEN, PIERRIC |
分类号 |
H01L21/18;H01L21/02;H01L21/98;H01L23/535 |
主分类号 |
H01L21/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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