MOLD FOR SEALING IC WITH RESIN,申请号JP19890310171-传众专利搜索

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发明名称	MOLD FOR SEALING IC WITH RESIN
摘要
申请公布号	JPH03169031(A)	申请公布日期	1991.07.22
申请号	JP19890310171	申请日期	1989.11.28
申请人	NEC KYUSHU LTD	发明人	MATSUKUMA HIDEMI
分类号	H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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