| 摘要 |
The present invention relates to an apparatus for etching a substrate. The apparatus significantly reduces the thickness of the substrate used for a flexible display device such as an OLED or various electric devices. The apparatus includes a plurality of etching nozzle parts which are placed apart from top edges of the surfaces of the multiple substrates arranged to be etched in the same line, and are arranged in parallel above the top edge; and a plurality of etching nozzles which are arranged at intervals on the etching nozzle part and spray an etching solution downward. Each etching nozzle part and each etching nozzle are located between the surfaces of the substrate to be etched. |
