| 摘要 |
<p>The present invention relates to a copper plating method of a multilayer printed circuit board without a generation of foreign substances by using ion palladium and, more specifically, to a method to plate the penetration hole of a multilayer printed circuit board, in which multiple conductors and non-conductors are alternatively laminated, by electroless copper plating by using conductive palladium ion solution. The method, as a pretreatment process before a catalyst treatment of a multilayer printed circuit board using conductive palladium ion solution, includes the following steps of: A) washing and conditioning the inner wall of a penetration hole with alkaline degreasing solution including amines and hydroxide by degreasing the multilayer printed circuit board; and B) removing the amines attached to the surface of the penetration hole by washing and etching the multilayer printed circuit board. By the forementioned composition, the copper plating method of a multilayer printed circuit board without a generation of foreign substances using ion palladium is able to prevent a fault from being generated in a copper plating by causing a short circuit when foreign substances, generated by aggregating amines with conductive palladium ion, flow into the surface and penetration hole of the multilayer printed circuit board in a catalyst treatment.</p> |
