PRESSURE-SENSITIVE HOT-MELT ADHESIVES ADHERING TO FLEXIBLE SUBSTRATES

摘要

A description is given of a pressure-sensitive hot-melt adhesive which features good low-temperature adhesion. The adhesive is used to bond film substrates to one another or to cardboard packaging. The adhesive is to contain 2% to 50% of styrene block copolymers, 1% to 30% of EVA polymers, and also 20% to 70% of tackifying resins and 5% to 40% of plasticizer. Suitability is possessed more particularly by mixtures with SIBS polymer.