Method of manufacturing semiconductor device, substrate processing method and substrate processing apparatus

摘要

A method of manufacturing a semiconductor device includes: housing a substrate into a processing chamber; and forming a metal nitride film on the substrate by supplying a source gas containing a metal element, a nitrogen-containing gas and a hydrogen-containing gas into the processing chamber; wherein in forming the metal nitride film, the source gas and the nitrogen-containing gas are intermittently supplied into the processing chamber, or the source gas and the nitrogen-containing gas are intermittently and alternately supplied into the processing chamber, or the source gas is intermittently supplied into the processing chamber in a state that supply of the nitrogen-containing gas into the processing chamber is continued, and the hydrogen-containing gas is supplied into the processing chamber during at least supply of the nitrogen-containing gas into the processing chamber.

主权项

1. A method of manufacturing a semiconductor device, comprising:
housing a substrate into a processing chamber; and forming a metal nitride film on the substrate by supplying a source gas containing a metal element, a nitrogen-containing gas being a reducing gas and a hydrogen-containing gas being a reducing gas into the processing chamber; wherein in forming the metal nitride film, the source gas and the nitrogen-containing gas are intermittently supplied into the processing chamber under a non-plasma atmosphere, or the source gas and the nitrogen-containing gas are intermittently and alternately supplied into the processing chamber under the non-plasma atmosphere, or the source gas is intermittently supplied into the processing chamber in a state that supply of the nitrogen-containing gas into the processing chamber under the non-plasma atmosphere is continued, the source gas and the nitrogen-containing gas are intermittently reacted with each other, to thereby intermittently form a metal nitride layer, and the hydrogen-containing gas is supplied into the processing chamber under the non-plasma atmosphere during at least supply of the nitrogen-containing gas into the processing chamber, to thereby modify the metal nitride layer.