发明名称 Substrate lamination system and method
摘要 The present disclosure is directed to a substrate lamination system and method.;A substrate lamination apparatus may comprise: (a) a vacuum chamber; (b) a flexible membrane; and (c) a substrate support.;A system for laminating substrates may comprise: (a) a vacuum chamber; (b) a flexible membrane; (c) a substrate support; (d) a vacuum pump; (e) a compressor; and (f) a control unit, wherein the control unit is configured to carry out the steps: (i) evacuating the vacuum chamber; and (ii) applying pressure to at least one of a first substrate and a second substrate.
申请公布号 US8936057(B2) 申请公布日期 2015.01.20
申请号 US200812009482 申请日期 2008.01.18
申请人 Rockwell Collins, Inc. 发明人 Sampica James D.;Nemeth Paul R.;Barnidge Tracy J.;Marzen Vincent P.
分类号 B32B37/00;B32B37/10;B32B38/18 主分类号 B32B37/00
代理机构 代理人 Suchy Donna P.;Barbieri Daniel M.
主权项 1. A substrate lamination apparatus, the apparatus comprising: a vacuum chamber comprising a base portion; a flexible membrane, the flexible membrane partitioning the vacuum chamber into a first compartment and a second compartment; a substrate support; and a substrate alignment insert removable from both the base portion of the vacuum chamber and the substrate support, the substrate alignment insert including a generally planar base portion and a plurality of alignment guides extending upward from the planar base portion, the generally planar base portion and the plurality of alignment guides defining an aperture extending through the substrate alignment insert and being configured to receive at least a portion of a substrate and align the substrate within the vacuum chamber.
地址 Cedar Rapids IA US