| 摘要 |
PROBLEM TO BE SOLVED: To suppress a board 10 from resonating with a case 60.SOLUTION: An electronic device S1 includes a board 10 and electronic components 20, 30 mounted on the board 10. A heat sink 50 includes: an overlapped portion 52 covered with the board 10 from a direction perpendicular to a board surface; and portions 53a, 53b protruding from end parts of the board 10 in a surface direction thereof. The heat sink is fixed to the board 10, and radiates heat generated from the electronic components 20, 30. A case 60 houses the board 10 together with the electronic components 20, 30 and the heat sink 50. The protruding portions 53a, 53b in the heat sink 50 are fixed to the case 60 by a mechanical connection part 64. Thus, the board 10 can be fixed to the case 60 via the heat sink 50. Accordingly, the board 10 can be firmly fixed to the case 60. |
