| 摘要 |
A composite material obtained by laminating (A) a layer formed of an epoxy resin curing composition including a polyamide compound having a structure containing a phenolic hydroxyl group represented by the following formula (I) or (II) in its repeating unit and (B) a layer of a polyimide to each other. The composite material is preferably obtained by applying the epoxy resin curing composition to at least one side of a polyimide film or sheet. In formula (I), ring A and R each represent an arylene group having 6 to 18 carbon atoms, an alkylidenediarylene group having 13 to 25 carbon atoms, etc. In formula (II), ring B is an arylene group having 6 to 18 carbon atoms or an alkylidenediaryl group having 13 to 25 carbon atoms.
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