SEMICONDUCTOR PACKAGE CONTAINING THROUGH ELECTRODE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package, along with its manufacturing method, containing a through electrode enabling reduction in step cost for improved productivity.SOLUTION: A semiconductor package containing a through electrode and a method of manufacturing the same include: a wafer level package in which a first semiconductor chip containing a first semiconductor substrate of a chip level having a first through electrode is molded with a first mold film for stacking, and which is formed on the entire surface of a second semiconductor substrate of a wafer level having a second through electrode; a chip level package in which a fourth semiconductor chip containing a fourth semiconductor substrate of a chip level is molded with a second mold film for stacking, and which is formed on the entire surface of a third semiconductor substrate of a chip level having a third through electrode; a plurality of chip level packages which are stacked on a rear surface of the second semiconductor substrate; the first mold film and the first semiconductor chip which are polished so that the first through electrode is exposed; and an external electrode which is connected to the first through electrode, and formed on the first semiconductor chip that has been polished.