ELECTRIC CONNECTING APPARATUS

摘要

The present invention reduces time to measurement start with a simple device structure. The present invention includes a wire substrate (14) placed in an upper part of a chuck top (21) and on which a wire path (14a) connected to a tester (11) is formed, a probe substrate (18) having a surface face the wire substrate (14) while having a gap from the wire substrate and on which a wire path (18e) corresponding to the wire path (14) is formed, a probe card (19) placed on the other surface of the probe substrate (18) by being connected to the wire path (18e) and including multiple probes (18a) touching each of multiple connection pads (28a) of a semiconductor wafer (28) on the chuck top (21), and an electric connection part (16) electrically connecting to the wire path (18e) and the wire path (14a) while connecting by heat conduction support members (16f,16g) reducing heat conduction between the wire substrate (14) and the probe substrate (18).